Changsha Panran Technology Co., Ltd.
The Core Value of Precision Digital Thermometers in Semiconductor Thermal Cycling Tests
Source: | Author:Olivia | Published time: 2025-01-17 | 54 Views | Share:
Semiconductor thermal cycling tests are an important means to evaluate the reliability and lifespan of chips. During the thermal cycling test, the chip needs to go through repeated high - temperature and low - temperature cycles to simulate the temperature changes during its actual use. Precision digital thermometers have core value in this test.
Firstly, precision digital thermometers provide an accurate temperature control benchmark for thermal cycling tests. When setting the high - temperature and low - temperature test points, their high - precision measurement capabilities ensure that the test environment temperature can accurately reach the set value. For example, when the high - temperature test point is set at 150℃, the precision digital thermometer can accurately measure and feedback the actual temperature, enabling the heating equipment to precisely adjust and ensure that the test environment temperature is stable within the range of 150℃±0.1℃, avoiding inaccurate test results due to temperature deviations.
Secondly, during the thermal cycling process, the rate of temperature change is also a key factor affecting the test results. The fast - response characteristics of precision digital thermometers can monitor the rate of temperature change in real - time. Staff can accurately control the operation of heating and cooling equipment according to the feedback data to ensure that the temperature rises or falls at a predetermined rate. This can more realistically simulate the temperature changes of the chip during actual use and improve the accuracy and reliability of thermal cycling tests.
Furthermore, precision digital thermometers can work stably for a long time and continuously provide accurate temperature data throughout the thermal cycling test process. These data are not only important bases for evaluating the performance of the chip under thermal cycling conditions, but also can explore the performance change laws of the chip under different temperature conditions through data analysis, providing strong support for chip design optimization and reliability improvement.