Ultra-precision micro-displacement systems are critical in applications requiring nanometer-scale positioning accuracy. Temperature variations can cause significant deformations in components such as piezoelectric actuators and micro-feed stages, adversely affecting system performance. Finite element analysis has been employed to model the deformation of micro-feed stages under temperature changes, providing insights into the mechanisms by which temperature influences positioning accuracy. Strategies to mitigate these effects include controlling the operating environment's temperature, selecting materials with low thermal expansion coefficients, and designing compensation mechanisms to counteract thermal-induced errors.